Ready to use paste for a wide array of applications including infiltration and sinterbrazing

Advantages over powder compaction:

  • Eliminates one compacting operation
  • Eliminates tooling inventory for compacting wafers
  • Improves materials handling
  • Paste is easier to handle than fragile wafer compacts
  • Ease of automation
  • Eliminates powder dust
  • Weight control is more precise
  • Density control is improved